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STLC8201
DUAL BAND WIRELESS LAN BASEBAND PROCESSOR
DATA BRIEF
1

FEATURES
Tri Mode 802.11a, 802.11g and 802.11b compliant. AgileRF allows fully automated roaming between different modes. Implements data rates of 6, 9, 12, 18, 24, 36, 48 and 54 Mbps in 802.11a and 802.11g modes, using an advanced OFDM processor with channel equalizer. Implements data rates of 1, 2, 5.5 and 11 Mbps in 802.11b mode, using advanced RAKE and decision feedback equalization. Improved PA efficiency using digital predistortion linearization and active bias control. Gain and Phase imbalance correction improves Rx sensitivity. Supports receive antenna diversity for both bands Supports 802.11b short preamble. On-chip 10 bit ADC and DAC converters for I/Q data. On-chip 10 bit DAC for analog AGC control. On-chip 10 bit DACs to support DC offset correction in Zero-IF systems. On-chip 10 bit DAC, and dedicated I/O to provide transmit power control (TPC). On-chip general purpose 10 bit ADC for power supply monitoring, PA output power monitoring or temperature sense. Hardware assisted 40 and 128 bit WEP and WEP2 (TKIP) engine. Hardware assisted AES encryption. A low frequency standby clock and advanced power management extend battery life in portable equipment. Powerful 32 bit CPU and protocol accelerator implement the MAC functionality. On-chip system memory removes the need for external FLASH or SRAM reducing complexity and cost. Firmware is loaded from the host processor allowing automated software upgrade. Supports UART, Cardbus32 and MiniPCI interfaces to host processor. Serial EEPROM memory interface to hold PCI/
Figure 1. Package
LBGA256 (17x17x1.7mm)
Table 1. Order Codes
Part Number STLC8201 Package LBGA256 Temp. range 0 to 70C

CardBus32 configuration. JTAG interface for manufacturing test, Software drivers for Microsoft Windows 2000TM, Windows XPTM, Win98/Me.
2

APPLICATIONS
Cardbus32 card wireless LAN adapters, MiniPCI card wireless LAN adapters, Wireless LAN access points and bridges.

3
DESCRIPTION
The STMicroelectronics STLC8201 wireless LAN baseband processor is an integrated Medium Access Controller and Physical Layer Processor. It is designed to directly interface with STMicroelectronics's STLC8100 RF transceiver, and with 3rd party power amplifiers to provide a complete wireless LAN solution compliant with IEEE802.11b, IEEE802.11g and IEEE802.11a. The STLC8201 includes a unique technology to deliver dual band multi-mode Access Point with band interleaving. This allows supporting clients in both bands without duplicating baseband or RF functionality. Powerful security features include WEP, WPA, WPA2 and AES encryption engines along with support for 802.1x authentication protocols. High quality multimedia streaming is enabled with Quality of Service (QoS) protocols supported by
Rev. 2 1/5

October 2004
This is preliminary information on a new product now in development. Details are subject to change without notice.
STLC8201
an advanced DMA engine that delivers packet prioritization. The chip comprises three major blocks: -Front End -Interface to the radio and PA -Modem - OFDM and CCK digital signal processing for RX and TX -MAC -CPU, protocol accelerator, memory, host and peripheral interfaces. The flexible Front-End RF interface provides baseband I/Q receive inputs and transmit outputs along with a general purpose serial interface for configuration and testing of the STLC8100 and PA module. The host interface supports mini-PCI and CardBus32. A powerful CPU is supported by the hardware accelerator that carries out the real time tasks of interpreting received packets then preparing and responding fast enough to deliver sustained 54MBits/sec throughput without losing the flexibility to future-proof the design. The embedded DMA engine increases efficiency by rapidly sorting data as it passes through the system without loading the processor core. Ample on-chip memory is provided to run all MAC software with sufficient space capacity to accommodate future enhancements avoiding the need for external flash. A serial EEPROM memory interface is provided on which the PCI/CardBus configuration and MAC address is stored. Figure 2. Block Diagram
DAC
Hardware Accelerator
Modem
CPU
STLC8100
Front End
System Memory
Host PC
ADC Logic
Host Interface
STLC8201
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STLC8201
Figure 3. LBGA256 (17x17x1.7mm) Mechanical Data & Package Dimensions
mm DIM. MIN. A A1 A2 b D D1 E E1 e f ddd 0.900 0.750 0.500 1.210 0.300 1.120 0.600 0.700 0.020 TYP. MAX. 1.700 MIN. 0.047 0.0118 0.044 0.024 0.669 0.590 0.669 0.590 1.100 1.250 0.200 0.035 0.029 0.039 0.039 0.043 0.049 0.008 0.677 0.027 0.677 TYP. MAX. 0.067 inch
OUTLINE AND MECHANICAL DATA
16.800 17.000 17.200 0.661 15.000 16.800 17.000 17.200 0.661 15.000 1.000 1.000
Body: 17 x 17 x 1.7mm
LBGA256 Low Profile Ball Grid Array
7177138 A
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STLC8201
Table 2. Revision History
Date
May 2004 October 2004
Revision
1 2 First Issue
Description of Changes
The name of the package change from LFBGA256 to LBGA256. Add operating temperature range in the table 1. Updated the fig. 2 Block Diagram.
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STLC8201
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2004 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
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